About Marvell 

Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities. 

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. 

Your Team, Your Impact

Be a significant part of the engineering team that enables the Connected Digital Lifestyle. Marvell’s expertise is delivering industrial leading silicon and platform solutions to datacenter processors, AI, networking and many more end applications to the world. We are the package engineering team that drives semiconductor package development from concept to mass production for all Marvell products. You are the talented individual who we are looking for to make an impact from Day One.

What You Can Expect

• Learn with product-based package projects from concept through development, prototyping, qualification, and volume production release.
• Engage in package substrate design and perform package substrate layout review using APD.
• Understand the basic process of FCBGA assembly and substrate fabrication.
• Apply engineering knowledge of assembly/substrate fabrication to develop new packages and DFX to improve yield and prevent manufacturing, quality, and reliability issues.

What We're Looking For

• Candidate MUST be currently pursuing a Ph. D or MS in Mechanical, Material, or Chemical Engineering
• Good verbal and written communication skills.
• Semiconductor package related experience is a plus.
• Basic semiconductor package design skills, PCB design concepts, AutoCAD and computer skills.